Invention Grant
- Patent Title: Package and packaging assembly of microelectromechanical system microphone
- Patent Title (中): 微机电系统麦克风的封装和封装组装
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Application No.: US11871149Application Date: 2007-10-11
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Publication No.: US07868402B2Publication Date: 2011-01-11
- Inventor: Chao-Ta Huang , Hsin-Tang Chien
- Applicant: Chao-Ta Huang , Hsin-Tang Chien
- Applicant Address: TW Hsinchu
- Assignee: Industrial Technology Research Institute
- Current Assignee: Industrial Technology Research Institute
- Current Assignee Address: TW Hsinchu
- Agency: Jianq Chyun IP Office
- Priority: TW96117297A 20070515
- Main IPC: H01L29/84
- IPC: H01L29/84
Abstract:
A package of microelectromechanical system (MEMS) microphone is suitable for being mounted on a printed circuit board. The package has a cover and at least one MEMS microphone. The cover has an inner surface and a conductive trace disposed thereon. The MEMS microphone is mounted on the inner surface of the cover and electrically connected to the conductive trace, and has an acoustic pressure receiving surface. When the cover is mounted on the printed circuit board, the cover and the printed circuit board construct an acoustic housing which has at least one acoustic hole passing through the cover or the printed circuit board, and the conductive trace on the inner surface of the cover is electrically connected to the printed circuit board.
Public/Granted literature
- US20080283988A1 PACKAGE AND PACKAGING ASSEMBLY OF MICROELECTROMECHANICAL SYSYEM MICROPHONE Public/Granted day:2008-11-20
Information query
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