Invention Grant
- Patent Title: Semiconductor device
- Patent Title (中): 半导体器件
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Application No.: US12267166Application Date: 2008-11-07
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Publication No.: US07868413B2Publication Date: 2011-01-11
- Inventor: Takashi Okuda , Toshio Kumamoto
- Applicant: Takashi Okuda , Toshio Kumamoto
- Applicant Address: JP Kanagawa
- Assignee: Renesas Electronics Corporation
- Current Assignee: Renesas Electronics Corporation
- Current Assignee Address: JP Kanagawa
- Agency: McDermott Will & Emery LLP
- Priority: JP2007-297735 20071116
- Main IPC: H01L21/762
- IPC: H01L21/762
Abstract:
It is an object of the present invention to surely protect a predetermined semiconductor element or a predetermined semiconductor element group in an analog block from a noise generated from a digital block. A semiconductor device according to the present invention includes a semiconductor substrate, a digital block to be a region in which a digital circuit is formed and an analog block to be a region in which an analog circuit is formed, arranged by separating an upper surface of the semiconductor substrate and a substrate potential fixing region provided on the semiconductor substrate so as to surround in a planar view the predetermined semiconductor element group in the analog block, and a pad connected to the substrate potential fixing region and receiving a predetermined potential from an external part.
Public/Granted literature
- US20090127713A1 SEMICONDUCTOR DEVICE Public/Granted day:2009-05-21
Information query
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