Invention Grant
- Patent Title: Integrated circuit package-on-package stacking system
- Patent Title (中): 集成电路封装堆叠系统
-
Application No.: US12730171Application Date: 2010-03-23
-
Publication No.: US07868434B2Publication Date: 2011-01-11
- Inventor: Dioscoro A. Merilo , Heap Hoe Kuan , You Yang Ong , Seng Guan Chow , Ma. Shirley Asoy
- Applicant: Dioscoro A. Merilo , Heap Hoe Kuan , You Yang Ong , Seng Guan Chow , Ma. Shirley Asoy
- Applicant Address: SG Singapore
- Assignee: Stats Chippac Ltd.
- Current Assignee: Stats Chippac Ltd.
- Current Assignee Address: SG Singapore
- Agent Mikio Ishimaru
- Main IPC: H01L23/495
- IPC: H01L23/495
Abstract:
An integrated circuit package-on-package stacking system includes a leadframe interposer including: a leadframe having a lead; a molded base on a portion of the lead for only supporting the lead; and the leadframe interposer singulated from the leadframe, wherein the lead is bent to support a stack-up height.
Public/Granted literature
- US20100176497A1 INTEGRATED CIRCUIT PACKAGE-ON-PACKAGE STACKING SYSTEM Public/Granted day:2010-07-15
Information query
IPC分类:
