Invention Grant
- Patent Title: Adhesive containing a filler, and a method for attaching and manufacturing a thin plate using the same
- Patent Title (中): 含有填料的粘合剂，以及使用其制造薄板的方法
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Application No.: US11298683Application Date: 2005-12-12
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Publication No.: US07868435B2Publication Date: 2011-01-11
- Inventor: Masaharu Ishizuka , Shigeru Shoji
- Applicant: Masaharu Ishizuka , Shigeru Shoji
- Applicant Address: JP Tokyo
- Assignee: TDK Corporation
- Current Assignee: TDK Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oliff & Berridge, PLC
- Priority: JP2004-359812 20041213
- Main IPC: H01L23/00
- IPC: H01L23/00 ; B32B27/38 ; C09J163/00 ; C08L63/00 ; B32B15/092
Abstract:
An adhesive comprises a base material which generates adhesive strength through curing, a hardening agent which promotes the curing of the base material, and a filler. In order to solve the problems mentioned above, the adhesive is made of particles having a maximum particle diameter of 0.8 μm or less.
Public/Granted literature
- US20060159930A1 Adhesive containing a filler, and a method for attaching and manufacturing a thin plate using the same Public/Granted day:2006-07-20
Information query
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