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US07868437B2 Mounting structure for IC tag and IC chip for mounting 失效
IC标签和IC芯片的安装结构

Mounting structure for IC tag and IC chip for mounting
Abstract:
A mounting structure for an IC tag where an IC chip for mounting (10) is mounted so as to be electrically connected to antenna patterns (44a), (44b). The assembly process that mounts the IC chip for mounting (10) on the antenna patterns (44a), (44b) is simplified, which makes it possible to reduce the manufacturing cost of IC tags. The IC chip for mounting 10 is formed by winding conductive wires (12a), (12b) so as to encircle an outer surface of an IC chip (20) between two opposite edges of the IC chip (20) in a state where the conductive wires (12a), (12b) mechanically contact electrodes formed on the IC chip (20) and are electrically connected to the electrodes, so that the IC chip for mounting (10) is joined to the antenna patterns (44a), (44b) via the conductive wires (12a), (12b).
Abstract(Chinese):

一种用于安装IC芯片（10）的IC标签的安装结构，以电连接到天线图案（44a），（44b）。 将用于安装（10）的IC芯片安装在天线图案（44a），（44b）上的组装过程被简化，这使得可以降低IC标签的制造成本。 用于安装的IC芯片10通过在导电（12a），（12b）之间缠绕以在IC芯片（20）的两个相对边缘之间环绕IC芯片（20）的外表面的方式形成，其中导电 电线（12a），（12b）机械地接触形成在IC芯片（20）上的电极，并与电极电连接，使得安装用IC芯片（10）与天线图案（44a），（44b） 经由导线（12a），（12b）。

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