Electronic modules and methods of fabrication are provided implementing a first metallization level directly on a chips-first chip layer. The chips-first layer includes chips, each with a pad mask over an upper surface and openings to expose chip contact pads. Structural dielectric material surrounds and physically contacts the side surfaces of the chips, and has an upper surface which is parallel to an upper surface of the chips. A metallization layer is disposed over the front surface of the chips-first layer, residing at least partially on the pad masks of the chips, and extending over one or more edges of the chips. Together, the pad masks of the chips, and the structural dielectric material electrically isolate the metallization layer from the edges of the chips, and from one or more electrical structures of the chips in the chips-first layer.