Invention Grant
- Patent Title: Semiconductor device and methods of manufacturing semiconductor devices
- Patent Title (中): 半导体装置及制造半导体装置的方法
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Application No.: US11850750Application Date: 2007-09-06
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Publication No.: US07868446B2Publication Date: 2011-01-11
- Inventor: Thorsten Meyer
- Applicant: Thorsten Meyer
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Dicke, Billig & Czaja, PLLC
- Main IPC: H01L23/488
- IPC: H01L23/488 ; H01L21/56
Abstract:
This application relates to a semiconductor device comprising a semiconductor chip, a molded body covering the semiconductor chip wherein the molded body comprises an array of recesses in a first surface of the molded body, first contact elements, and elastic elements in the recesses that connect the first contact elements with the molded body.
Public/Granted literature
- US20090065927A1 Semiconductor Device and Methods of Manufacturing Semiconductor Devices Public/Granted day:2009-03-12
Information query
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