Invention Grant
- Patent Title: Adapter board and method for manufacturing same, probe card, method for inspecting semiconductor wafer, and method for manufacturing semiconductor device
- Patent Title (中): 适配器板及其制造方法，探针卡，半导体晶片检查方法以及半导体器件的制造方法
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Application No.: US12320261Application Date: 2009-01-22
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Publication No.: US07868469B2Publication Date: 2011-01-11
- Inventor: Osamu Mizoguchi
- Applicant: Osamu Mizoguchi
- Applicant Address: JP Kawasaki-shi, Kanagawa
- Assignee: Renesas Electronics Corporation
- Current Assignee: Renesas Electronics Corporation
- Current Assignee Address: JP Kawasaki-shi, Kanagawa
- Agency: McGinn IP Law Group, PLLC
- Priority: JP2008-180601 20080710
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/14
Abstract:
An adapter board includes a package substrate having a first surface and a second surface and further including a board having wirings formed therein, pads disposed in the device side, and the pads disposed in the bump side, an insulating resin layer joined to the first surface, through holes formed in the positions corresponding to the pads in the insulating resin layer, vias formed in the through holes, and pads covering the through holes, wherein the pads are electrically coupled to the pads through the wirings, and the pads are electrically coupled to the pads through the vias.
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Information query
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