An electronic device burn-in thermal management system includes Burn-in-Boards (BIBs) with quick disconnect connectors to easily connect and disconnect the BIB (102) from liquid cooling lines (104, 106) in a rack that can hold one or more BIBs. The BIB (102) may include liquid cooled heat sinks (408) embedded in the BIB sockets (406) in order to cool the electronic devices undergoing burn-in test (DUT). This arrangement allows the DUT to make positive thermal contact with the heat sink when it is mounted in the BIB socket and allows the user to remove the BIB (102) quickly after completing a test to load the next batch of DUTs onto a separate BIB.