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US07868729B2 Stacked device assembly with integrated coil and method of forming same 有权
具有集成线圈的堆叠器件组件及其形成方法

Stacked device assembly with integrated coil and method of forming same
Abstract:
A stacked semiconductor device assembly (20) includes a device (24) having conductive traces (34) formed therein, and conductive interconnects (28) electrically connected to the conductive traces (34). Another device (26) has conductive traces (44) formed therein and device pads (54) formed on an outer surface (52) of the device (26). A method (120) entails attaching (84) a magnetic core (30) to an outer surface (42) of the device (24) and forming (92) the conductive interconnects (28) on the outer surface (42) using a stud bumping technique such that the interconnects (28) surround the magnetic core (30). The conductive interconnects (28) are coupled (126) with the device pads (54) using thermocompression bonding to couple the device (26) with the device (24) to form a continuous device coil (22) wrapped around the magnetic core (30) from an alternating electrical connection of the traces (34), the conductive interconnects (28), and the traces (44).
Abstract(Chinese):

层叠的半导体器件组件（20）包括其中形成有导电迹线（34）的器件（24）和电连接到导电迹线（34）的导电互连（28）。 另一个装置（26）具有形成在其中的导电迹线（44）和形成在装置（26）的外表面（52）上的装置焊盘（54）。 方法（120）需要将磁芯（84）附接到装置（24）的外表面（42）上，并且使用螺柱（92）在外表面（42）上形成（92）导电互连件（28） 使得互连（28）围绕磁芯（30）的凸起技术。 使用热压接将导电互连（28）与器件焊盘（54）耦合（126），以将器件（26）与器件（24）耦合以形成围绕磁芯（30）缠绕的连续器件线圈（22） ）从导线（34），导电互连（28）和迹线（44）的交替电连接。

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