Invention Grant
- Patent Title: Sensor attached IC tag application high voltage equipment
- Patent Title (中): 传感器附加IC标签应用高压设备
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Application No.: US11868111Application Date: 2007-10-05
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Publication No.: US07868755B2Publication Date: 2011-01-11
- Inventor: Masahiro Hanai , Haruhisa Wada , Hirokazu Takagi , Shiro Maruyama , Masayuki Sato
- Applicant: Masahiro Hanai , Haruhisa Wada , Hirokazu Takagi , Shiro Maruyama , Masayuki Sato
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2006-279140 20061012
- Main IPC: G08B1/06
- IPC: G08B1/06 ; G08B21/00 ; H04B1/03 ; H05K5/02 ; H05K9/00

Abstract:
To shorten a period of time necessary for performing routine inspections and reduce costs by monitoring a state such as a contact failure of a switching equipment which constitutes a power reception circuit or a branch circuit of a substation through a simple construction. A sensor attached IC tag application high voltage equipment is constructed by detachably mounting a sensor attached IC tag at a position where a sensor of a sensor attached IC tag obtains a physical quantity of a detection target, wherein the sensor attached IC tag is configured to communicate with an externally located IC tag reader.
Public/Granted literature
- US20080087115A1 SENSOR ATTACHED IC TAG APPLICATION HIGH VOLTAGE EQUIPMENT Public/Granted day:2008-04-17
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