Invention Grant
- Patent Title: Thermal printer with reduced donor adhesion
- Patent Title (中): 具有降低供体粘附性的热敏打印机
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Application No.: US11747821Application Date: 2007-05-11
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Publication No.: US07868906B2Publication Date: 2011-01-11
- Inventor: Robert F. Mindler , Daniel P. Hannon
- Applicant: Robert F. Mindler , Daniel P. Hannon
- Applicant Address: US NY Rochester
- Assignee: Eastman Kodak Company
- Current Assignee: Eastman Kodak Company
- Current Assignee Address: US NY Rochester
- Agent Roland R. Schindler; Eugene I. Shkurko
- Main IPC: B41J2/335
- IPC: B41J2/335

Abstract:
Thermal printers and methods for operating thermal printers are provided. In one method, a sequence of thermal print head control signals is generated that is adapted to cause an array of thermal elements to cause the donor material to transfer from a donor ribbon in a manner that is modulated in accordance with image data and attenuated in accordance with an attenuation pattern. A receiver medium is urged through the printing nip while the thermal print head control signals are transmitted to the thermal print head to cause the donor material to transfer from the donor web in an image modulated pattern having a longitudinal length that is larger than a longitudinal length of the receiver medium. The attenuation pattern provides a relatively high level of attenuation at a portion of the printing wherein there is greater risk that the receiver medium will not be within the printing nip.
Public/Granted literature
- US20080278561A1 Thermal printer with reduced donor adhesion Public/Granted day:2008-11-13
Information query
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