Invention Grant
- Patent Title: Data processing device
- Patent Title (中): 数据处理装置
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Application No.: US12272814Application Date: 2008-11-18
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Publication No.: US07869205B2Publication Date: 2011-01-11
- Inventor: Te-Sen Chin
- Applicant: Te-Sen Chin
- Applicant Address: TW Taipei
- Assignee: Compal Electronics, Inc.
- Current Assignee: Compal Electronics, Inc.
- Current Assignee Address: TW Taipei
- Agency: Jianq Chyun IP Office
- Priority: TW97135250A 20080912
- Main IPC: G06F1/16
- IPC: G06F1/16

Abstract:
A data processing device including a first housing, a second housing, and a bracket is provided. The bracket is disposed between the first housing and the second housing. The bracket has a body and a plurality of supporting ends. The body has a bearing surface and a supporting surface. The bearing surface faces the first housing, and does not contact the first housing. The supporting surface faces the second housing, and does not contact the second housing. The supporting ends are disposed around the body and contact the first housing to support the body. A first distance between the supporting surface relatively away from the supporting ends and the second housing is larger than a second distance between the supporting surface relatively close to the supporting ends and the second housing.
Public/Granted literature
- US20100067183A1 DATA PROCESSING DEVICE Public/Granted day:2010-03-18
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