Invention Grant
- Patent Title: Composite avionics chassis
- Patent Title (中): 复合航空电子机箱
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Application No.: US12198008Application Date: 2008-08-25
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Publication No.: US07869216B2Publication Date: 2011-01-11
- Inventor: James F. Stevenson , David C. Vacanti , Steve Erik Sund , Siu-ching D. Lui
- Applicant: James F. Stevenson , David C. Vacanti , Steve Erik Sund , Siu-ching D. Lui
- Applicant Address: US NJ Morristown
- Assignee: Honeywell International Inc.
- Current Assignee: Honeywell International Inc.
- Current Assignee Address: US NJ Morristown
- Agency: Black Lowe & Graham, PLLC
- Main IPC: H05K7/20
- IPC: H05K7/20

Abstract:
An avionics chassis for protecting against damage, dust, dirt and incidental moisture over an extended temperature range, EMI shielding to prevent radiation of internal circuit energy and preventing the entrance of external EMI. The chassis provides lower weight, lower levels of radiated emissions and improved resistance to incident external radiation. Electric and magnetic shielding is also provided.
Public/Granted literature
- US20100046170A1 COMPOSITE AVIONICS CHASSIS Public/Granted day:2010-02-25
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