Invention Grant
- Patent Title: Stiffening support for printed circuit assemblies
- Patent Title (中): 加强对印刷电路组件的支持
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Application No.: US12180227Application Date: 2008-07-25
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Publication No.: US07869220B2Publication Date: 2011-01-11
- Inventor: Todd L. Braman , Dale Hagenson , Jacob Weinmann
- Applicant: Todd L. Braman , Dale Hagenson , Jacob Weinmann
- Applicant Address: US NJ Morristown
- Assignee: Honeywell International Inc.
- Current Assignee: Honeywell International Inc.
- Current Assignee Address: US NJ Morristown
- Agency: Fogg & Powers LLC
- Main IPC: H05K7/12
- IPC: H05K7/12

Abstract:
A packaging assembly includes a printed circuit assembly coupled to a stiffening device, which may take the form of a custom-shaped stiffening member or take the form of a support member having spokes attached to a rim. The printed circuit assembly includes a printed circuit board with a number of electrical components extending from a surface of the board. The stiffening member or the support member includes openings that receive the electrical components while providing additional stiffness to the board.
Public/Granted literature
- US20100020511A1 STIFFENING SUPPORT FOR PRINTED CIRCUIT ASSEMBLIES Public/Granted day:2010-01-28
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