Invention Grant
- Patent Title: Memory module
- Patent Title (中): 内存模块
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Application No.: US12180054Application Date: 2008-07-25
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Publication No.: US07869243B2Publication Date: 2011-01-11
- Inventor: Abdallah Bacha
- Applicant: Abdallah Bacha
- Applicant Address: DE Munich
- Assignee: Qimonda AG
- Current Assignee: Qimonda AG
- Current Assignee Address: DE Munich
- Agent John S. Economou
- Priority: DE102007035180 20070727
- Main IPC: G11C5/06
- IPC: G11C5/06 ; H05K7/00 ; H05K1/18 ; H05K1/16

Abstract:
A memory module with a module board is disclosed, on the front side of which a plurality of first memory devices are arranged in rows. A plurality of second memory devices are arranged in rows on the back side. The first and second memory devices have a single chip each. Further, a first register device for providing first control signals to first rows of first memory devices and to first rows of second memory devices is provided. A second register device serves to provide first control signals to second rows of first memory devices and to second rows of second memory devices.
Public/Granted literature
- US20090027940A1 Memory Module Public/Granted day:2009-01-29
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