Invention Grant
US07869574B2 Braze assembly with beryllium diffusion barrier and method of making same
有权
具有铍扩散屏障的钎焊装配及其制造方法
- Patent Title: Braze assembly with beryllium diffusion barrier and method of making same
- Patent Title (中): 具有铍扩散屏障的钎焊装配及其制造方法
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Application No.: US12327255Application Date: 2008-12-03
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Publication No.: US07869574B2Publication Date: 2011-01-11
- Inventor: Gregory Alan Steinlage , Thomas C. Tiearney , Donald Robert Allen
- Applicant: Gregory Alan Steinlage , Thomas C. Tiearney , Donald Robert Allen
- Applicant Address: US NY Schenectady
- Assignee: General Electric Company
- Current Assignee: General Electric Company
- Current Assignee Address: US NY Schenectady
- Agency: Ziolkowski Patent Solutions Group, SC
- Main IPC: G21K1/00
- IPC: G21K1/00 ; B23K1/19
Abstract:
A bonded assembly includes a member, and a substrate comprising beryllium, the substrate configured to be bonded to the member. The bonded assembly includes a first barrier applied to a surface of the substrate, a second barrier applied to a surface of the first barrier, a bonding material disposed between the second barrier and the member, and wherein the second barrier is configured to prevent dissolution of the first barrier into the bonding material.
Public/Granted literature
- US20100135466A1 BRAZE ASSEMBLY WITH BERYLLIUM DIFFUSION BARRIER AND METHOD OF MAKING SAME Public/Granted day:2010-06-03
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