A sound box type earphone housing for use in a headset is disclosed to include a body shell having a coupling flange, a springy earphone clamp fastened to the inside of the body shell and having a front clamping hole for securing an earplug type earphone, and an annular cover member, which has a coupling groove coupled to the coupling flange of the body shell, a center opening hole, and a hanging portion extending around the top side of the center opening hole for hanging the annular cover member on the user's ear.