Invention Grant
- Patent Title: Information processing apparatus, semiconductor manufacturing system, information processing method, and storage medium
- Patent Title (中): 信息处理装置,半导体制造系统,信息处理方法和存储介质
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Application No.: US11754643Application Date: 2007-05-29
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Publication No.: US07869888B2Publication Date: 2011-01-11
- Inventor: Noriaki Koyama , Minoru Obata , Wenling Wang
- Applicant: Noriaki Koyama , Minoru Obata , Wenling Wang
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2006-151803 20060531; JP2006-156764 20060606
- Main IPC: G05B13/02
- IPC: G05B13/02 ; G06F19/00

Abstract:
A information processing apparatus 100 for processing an acquired value, which is a value acquired in regard to a state during a treatment, performed by a semiconductor manufacturing apparatus 200 for performing a treatment on a treatment target containing a semiconductor according to a set value, which is a value for setting a condition of a treatment, includes: a set value receiving portion 101 for receiving the set value; a state value receiving portion 102 for receiving the acquired value; a correction amount calculating portion 103 for calculating a correction amount of the acquired value, using a correction function indicating a relationship between the set value and the acquired value; a correcting portion 104 for correcting the acquired value received by the state value receiving portion 102, using the correction amount calculated by the correction amount calculating portion 103; and an output portion 105 for outputting a result of correction performed by the correcting portion 104.
Public/Granted literature
Information query