Invention Grant
US07869896B2 Tangential grinding resistance measuring method and apparatus, and applications thereof to grinding condition decision and wheel life judgment
有权
切向磨削阻力测量方法和装置,以及其在磨削条件决定和车轮寿命判断中的应用
- Patent Title: Tangential grinding resistance measuring method and apparatus, and applications thereof to grinding condition decision and wheel life judgment
- Patent Title (中): 切向磨削阻力测量方法和装置,以及其在磨削条件决定和车轮寿命判断中的应用
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Application No.: US11837781Application Date: 2007-08-13
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Publication No.: US07869896B2Publication Date: 2011-01-11
- Inventor: Yasuhira Yamada , Hiroshi Morita
- Applicant: Yasuhira Yamada , Hiroshi Morita
- Applicant Address: JP Osaka-shi
- Assignee: JTEKT Corporation
- Current Assignee: JTEKT Corporation
- Current Assignee Address: JP Osaka-shi
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2006-227618 20060824; JP2006-227754 20060824
- Main IPC: G06F19/00
- IPC: G06F19/00 ; B24B49/00 ; B24B51/00 ; G11B5/127 ; H04R31/00 ; B23P15/06

Abstract:
A tangential grinding resistance measuring method includes obtaining an abrasive grain section area which is at a predetermined infeed depth from the highest top surface of abrasive grains on a grinding wheel; calculating the tangent of a half vertex angle of a conical model for cutting edges of the abrasive grains which model takes the abrasive grain section area as its bottom surface and the predetermined depth as its height; setting grinding parameters; and calculating a tangential grinding resistance from the grinding parameters and the tangent.
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