Invention Grant
- Patent Title: Inspection method and its apparatus, inspection system
- Patent Title (中): 检验方法及其装置,检验制度
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Application No.: US10936501Application Date: 2004-09-09
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Publication No.: US07869966B2Publication Date: 2011-01-11
- Inventor: Takafumi Okabe , Shunji Maeda , Kaoru Sakai
- Applicant: Takafumi Okabe , Shunji Maeda , Kaoru Sakai
- Applicant Address: JP Tokyo
- Assignee: Hitachi, Ltd.
- Current Assignee: Hitachi, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Antonelli, Terry, Stout & Kraus, LLP.
- Priority: JP2001-278750 20010913
- Main IPC: G01N37/00
- IPC: G01N37/00

Abstract:
The present invention relates to a tool for analyzing by priority a defect having a high possibility of causing an electrical failure when inspecting a particle and a pattern defect in a piece of work which constitutes an electronic device such as a semiconductor integrated circuit, and relates to a system therefor. On the basis of the result of comparison between defect information which is the result of inspection by an inspection tool and layout data stored in an auxiliary storage device, or on the basis of the result of reinspection by comparison between a defect and a wiring pattern as a background by an inspection processing operation unit, an object to be reviewed is selected using review conditions stored in the auxiliary storage device.
Public/Granted literature
- US20050033538A1 Inspection method and its apparatus, inspection system Public/Granted day:2005-02-10
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