Invention Grant
- Patent Title: Defect review apparatus and method of reviewing defects
- Patent Title (中): 缺陷检查设备和检查缺陷的方法
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Application No.: US12108068Application Date: 2008-04-23
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Publication No.: US07869969B2Publication Date: 2011-01-11
- Inventor: Takehiro Hirai , Kenji Obara , Kohei Yamaguchi
- Applicant: Takehiro Hirai , Kenji Obara , Kohei Yamaguchi
- Applicant Address: JP Tokyo
- Assignee: Hitachi High-Technologies Corporation
- Current Assignee: Hitachi High-Technologies Corporation
- Current Assignee Address: JP Tokyo
- Agency: Crowell & Moring LLP
- Priority: JP2007-117254 20070426
- Main IPC: G01C17/38
- IPC: G01C17/38 ; G01N21/86

Abstract:
A defect review apparatus for reviewing a specimen by moving the specimen to pre-calculated coordinate includes: a function to measure a deviation amount between the pre-calculated coordinates and coordinates of an actual position of the specimen; a function to optimize a coordinate correcting expression to minimize the measured deviation amount; and a function to determine that the deviation amounts have converged. When the deviation amounts have converged, the measurement for the coordinate-correcting-expression optimization is terminated, minimizing a reduction in throughput. field of view (FOV) necessary for the specimen to be within the FOV is set according to a convergence value of the calculated deviation amount.
Public/Granted literature
- US20080270044A1 Defect Review Apparatus and Method of Reviewing Defects Public/Granted day:2008-10-30
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