Invention Grant
US07870258B2 Seamless fail-over support for virtual interface architecture (VIA) or the like
有权
虚拟接口架构（VIA）等的无缝故障切换支持
- Patent Title: Seamless fail-over support for virtual interface architecture (VIA) or the like
- Patent Title (中): 虚拟接口架构（VIA）等的无缝故障切换支持
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Application No.: US09924731Application Date: 2001-08-08
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Publication No.: US07870258B2Publication Date: 2011-01-11
- Inventor: Sharad K. Sundaresan , Balasubramanian Sriram
- Applicant: Sharad K. Sundaresan , Balasubramanian Sriram
- Applicant Address: US WA Redmond
- Assignee: Microsoft Corporation
- Current Assignee: Microsoft Corporation
- Current Assignee Address: US WA Redmond
- Agency: Woodcock Washburn LLP
- Main IPC: G06F15/16
- IPC: G06F15/16 ; G06F11/00
Abstract:
To connect a client application to a server ‘server’ on a cluster ‘cluster’ having a plurality of servers instantiated thereon, ‘cluster’ and ‘server’ are received from the client application, a first request message is sent to ‘cluster’ requesting first connection information for connecting to ‘server’, a first reply message containing the requested first connection information is received from ‘cluster’, and the client application is connected to ‘server’ on ‘cluster’ based on the received first connection information. Thereafter, the connection to ‘server’ fails, and a second request message is sent to ‘cluster’ requesting second connection information for connecting to ‘server’, a second reply message containing the requested second connection information is received from ‘cluster’, and the client application is again connected to ‘server’ on ‘cluster’ based on the received second connection information.
Public/Granted literature
- US20030033412A1 Seamless fail-over support for virtual interface architecture (VIA) or the like Public/Granted day:2003-02-13
Information query
