Invention Grant
- Patent Title: System for using partitioned masks to build a chip
- Patent Title (中): 使用分区掩码构建芯片的系统
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Application No.: US12117841Application Date: 2008-05-09
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Publication No.: US07870531B2Publication Date: 2011-01-11
- Inventor: Subhrajit Bhattacharya , John Darringer , Daniel L. Ostapko
- Applicant: Subhrajit Bhattacharya , John Darringer , Daniel L. Ostapko
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Hoffman Warnick LLC
- Agent Brian Verminski
- Main IPC: G06F17/50
- IPC: G06F17/50

Abstract:
A mask reuse methodology process in which the soft logic is implemented with a generic array type cell structure mask and a custom blocking mask. A system is provided comprising a mask set having a plurality of reusable masks corresponding to a plurality of hard intellectual property (IP) components; a generic array type cell mask; and a custom blocking mask that includes blocking regions that positionally correspond with a set of IP components printed on a die.
Public/Granted literature
- US20080216037A1 SYSTEM FOR USING PARTITIONED MASKS TO BUILD A CHIP Public/Granted day:2008-09-04
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