A conductor circuit and method of manufacturing a conductor circuit. The method includes forming a continuous conductor pattern on an insulating substrate, and connecting a short-circuit wire at a first position on the continuous conductor pattern such that two or more points on the continuous conductor pattern are short-circuited to each other by the short-circuit wire at the first position. An electrolytic plating film is formed on the continuous conductor pattern while the short-circuit wire is connected to the continuous conductor pattern at the first position, and the short-circuit wire is removed from the first position on the continuous conductor pattern to uncover a first exposed portion of the continuous conductor pattern.