A semiconductor package socket (1, 101) has a socket base (10, 110) including a package rest (11, 111) on which a semiconductor package (50) having gull-wing leads (52) is put, a cover member (20, 120) movably attached on the socket base, and a plurality of contacts (30, 130) each including a first contact piece (31, 131) capable of making contact, from above, with a horizontal shoulder portion of the lead, a second contact piece (32, 132) capable of making contact, laterally, with a vertical leg portion of the lead and a fixed portion, and formed to advance onto or retract from the package rest due to vertical movement of the cover member. The package rest is formed with a dam wall that allows the leads to be lied thereover, wherein the first and the second contact pieces each have an elastic deforming portion to determine a contact pressure.