Invention Grant
- Patent Title: Method of operating vacuum deposition apparatus and vacuum deposition apparatus
- Patent Title (中): 操作真空沉积设备和真空沉积设备的方法
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Application No.: US11593619Application Date: 2006-11-07
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Publication No.: US07871667B2Publication Date: 2011-01-18
- Inventor: Hideaki Awata , Katsuji Emura , Kentaro Yoshida
- Applicant: Hideaki Awata , Katsuji Emura , Kentaro Yoshida
- Applicant Address: JP Osaka
- Assignee: Sumitomo Electric Industries, Ltd.
- Current Assignee: Sumitomo Electric Industries, Ltd.
- Current Assignee Address: JP Osaka
- Agency: McDermott Will & Emery LLP
- Priority: JP2005/329969 20051115
- Main IPC: C23C16/00
- IPC: C23C16/00 ; C23C16/52

Abstract:
In a previous experiment of a deposition work of depositing a film with a uniform thickness on a long strip base material in the longitudinal direction thereof, an elapsed time from the start of the deposition work and an output of a power supply at the elapsed time are measured. The resulting relation between the elapsed time and the output is stored in a storage device. Subsequent deposition on a long strip base material is performed by a method in which first, the output of the power supply is controlled to be stabilized at a desired value using a crystal oscillator thickness gauge in a pre-heating step before the start of the deposition work, and then, a base material transport device is driven to start the deposition work on the long strip base material after a desired deposition rate is obtained. After the start of the deposition work, the output of the power supply is controlled to coincide with the output at the elapsed time stored in the storage device.
Public/Granted literature
- US20070110892A1 Method of operating vacuum deposition apparatus and vacuum deposition apparatus Public/Granted day:2007-05-17
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