Disclosed is a conductive material for a connecting part, including: a base material made up of a Cu strip; a Cu—Sn alloy covering layer having an average thickness of 0.2 to 3.0 μm; and an Sn covering layer, the Cu—Sn alloy covering layer being provided between the base material and the Sn covering layer, wherein in a cross section perpendicular to the surface of the conductive material, the diameter [D1] of the minimum inscribed circle of the Sn covering layer is 0.2 μm or less, the diameter [D2] of the maximum inscribed circle of the Sn covering layer is 1.2 to 20 μm, the difference in elevation [y] between the outermost point of the material and the outermost point of the Cu—Sn alloy covering layer is 0.2 μm or less, and a bright or semi-bright tin electroplating layer having an average thickness of 0.01 μm or more in an approximately uniform thickness is formed on the outermost layer as part of the Sn covering layer.