Invention Grant
- Patent Title: Resist composition
- Patent Title (中): 抗蚀组成
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Application No.: US11578587Application Date: 2005-04-14
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Publication No.: US07871751B2Publication Date: 2011-01-18
- Inventor: Masatoshi Echigo , Dai Oguro
- Applicant: Masatoshi Echigo , Dai Oguro
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Gas Chemical Company, Inc.
- Current Assignee: Mitsubishi Gas Chemical Company, Inc.
- Current Assignee Address: JP Tokyo
- Agency: Antonelli, Terry, Stout & Kraus, LLP.
- Priority: JP2004-120542 20040415
- International Application: PCT/JP2005/007226 WO 20050414
- International Announcement: WO2005/101127 WO 20051027
- Main IPC: G03F7/038
- IPC: G03F7/038

Abstract:
A radiation-sensitive composition containing a resist compound A, an acid generator B, and an acid crosslinking agent C. The resist compound A is (a) a polyphenol compound which is produced by the condensation of a C5-45 aromatic ketone or aromatic aldehyde with a C6-15 compound having from 1 to 3 phenolic hydroxyl groups, and, (b) its molecular weight is form 300 to 5000. The radiation-sensitive composition is solvent-soluble and exhibits a high sensitivity, high resolution, and high heat resistance.
Public/Granted literature
- US20080153031A1 Resist composition Public/Granted day:2008-06-26
Information query
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