Invention Grant
- Patent Title: Method for packaging light-emitting diode
- Patent Title (中): 封装发光二极管的方法
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Application No.: US12418552Application Date: 2009-04-03
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Publication No.: US07871835B2Publication Date: 2011-01-18
- Inventor: Shu-Ling Yeh , Ya-Lan Chuang , Pei-Jung Tsai , Chih-Hsiang Lin , Hsin-Ching Kao , Feng-Chih Chang , Tang-Jung Wu
- Applicant: Shu-Ling Yeh , Ya-Lan Chuang , Pei-Jung Tsai , Chih-Hsiang Lin , Hsin-Ching Kao , Feng-Chih Chang , Tang-Jung Wu
- Applicant Address: TW TW
- Assignee: Industrial Technology Research Institute,Topco Technologies Corp.
- Current Assignee: Industrial Technology Research Institute,Topco Technologies Corp.
- Current Assignee Address: TW TW
- Agency: Lowe Hauptman Ham & Berner, LLP
- Priority: TW97132383A 20080825
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L21/469 ; H01L21/31
Abstract:
Disclosed is a method for packaging an LED by a thermoplastic copolymer. The copolymer is polymerized by 100 parts by weight of an acrylic ester, 0.1 to 30 parts by weight of a hydrogen bond monomer, and 0.1 to 70 parts by weight of a bulky monomer. The copolymer has transparency greater than 90%, thermal resistance greater than 130° C., and moisture absorption less than 0.5 wt %, such that the copolymer may be applied as packaging material for a light emitting device.
Public/Granted literature
- US20100047936A1 METHOD FOR PACKAGING LIGHT-EMITTING DIODE Public/Granted day:2010-02-25
Information query
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