Invention Grant
- Patent Title: Semiconductor device and method of manufacturing the same
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US12271042Application Date: 2008-11-14
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Publication No.: US07871867B2Publication Date: 2011-01-18
- Inventor: Naohiro Ueda , Masato Kijima
- Applicant: Naohiro Ueda , Masato Kijima
- Applicant Address: JP Tokyo
- Assignee: Ricoh Company, Ltd.
- Current Assignee: Ricoh Company, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Cooper & Dunham LLP
- Priority: JP2005-056850 20050302
- Main IPC: H01L21/332
- IPC: H01L21/332

Abstract:
A semiconductor device is disclosed that comprises a high breakdown voltage MOSFET. The MOSFET includes a source region of a second conductivity type and a drain region of the second conductivity type formed apart from each other in a well region of a first conductivity type, a channel region formed between the source region and the drain region, a gate insulation film formed on the channel region, a LOCOS oxide film having greater film thickness than the gate insulation film, and a gate electrode formed across the gate insulation film and the LOCOS oxide film.
Public/Granted literature
- US20090068811A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2009-03-12
Information query
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