Invention Grant
- Patent Title: Manufacturing method of contact structure
- Patent Title (中): 接触结构的制造方法
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Application No.: US12368983Application Date: 2009-02-10
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Publication No.: US07871918B2Publication Date: 2011-01-18
- Inventor: Shyh-Ming Chang
- Applicant: Shyh-Ming Chang
- Applicant Address: TW Hsinchu TW Taoyuan TW Hsinchu TW Taipei County TW Tainan County TW Hsinchu TW Miao-Li County
- Assignee: Taiwan TFT LCD Association,Chunghwa Picture Tubes, Ltd.,Au Optronics Corporation,Hannstar Display Corporation,Chi Mei Optoelectronics Corporation,Industrial Technology Research Institute,TPO Dispalys Corp.
- Current Assignee: Taiwan TFT LCD Association,Chunghwa Picture Tubes, Ltd.,Au Optronics Corporation,Hannstar Display Corporation,Chi Mei Optoelectronics Corporation,Industrial Technology Research Institute,TPO Dispalys Corp.
- Current Assignee Address: TW Hsinchu TW Taoyuan TW Hsinchu TW Taipei County TW Tainan County TW Hsinchu TW Miao-Li County
- Agency: Jianq Chyun IP Office
- Priority: TW95127901A 20060728; TW95139501A 20061026; TW96101568A 20070106
- Main IPC: H01L21/44
- IPC: H01L21/44

Abstract:
A manufacturing method of a contact structure includes first providing a substrate on which a contact pad has already been formed. Afterwards, a polymer bump is formed on the contact pad. Next, a conductive layer is formed on the polymer bump. The conductive layer covers the polymer bump and extends to the outside of the polymer bump. The portion of the conductive layer extending to the outside of the polymer bump serves as a test pad.
Public/Granted literature
- US20090149015A1 MANUFACTURING METHOD OF CONTACT STRUCTURE Public/Granted day:2009-06-11
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