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US07871918B2 Manufacturing method of contact structure 有权
接触结构的制造方法

Manufacturing method of contact structure
Abstract:
A manufacturing method of a contact structure includes first providing a substrate on which a contact pad has already been formed. Afterwards, a polymer bump is formed on the contact pad. Next, a conductive layer is formed on the polymer bump. The conductive layer covers the polymer bump and extends to the outside of the polymer bump. The portion of the conductive layer extending to the outside of the polymer bump serves as a test pad.
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