Methods of forming interconnection structures for semiconductor devices

Invention Grant

US07871921B2 Methods of forming interconnection structures for semiconductor devices 有权

Title translation: 形成半导体器件互连结构的方法

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Patent Title: Methods of forming interconnection structures for semiconductor devices
Patent Title (中): 形成半导体器件互连结构的方法
Application No.: US11022240

Application Date: 2004-12-22
Publication No.: US07871921B2

Publication Date: 2011-01-18
Inventor: Jin-Taek Park , Jong-Ho Park , Sung-Hoi Hur , Hyun-Suk Kim
Applicant: Jin-Taek Park , Jong-Ho Park , Sung-Hoi Hur , Hyun-Suk Kim
Applicant Address: KR Gyeonggi-do
Assignee: Samsung Electronics Co., Ltd.
Current Assignee: Samsung Electronics Co., Ltd.
Current Assignee Address: KR Gyeonggi-do
Agency: Myers Bigel Sibley & Sajovec, P.A.
Priority: KR10-2004-0048119 20040625
Main IPC: H01L21/4763
IPC: H01L21/4763

Methods of forming interconnection structures for semiconductor devices

Abstract:

An interconnection structure for a semiconductor device includes an inter-level insulation layer disposed on a semiconductor substrate. First contact constructions penetrate the inter-level insulation layer. Second contact constructions penetrate the inter-level insulation layer. Metal interconnections connect the first contact constructions to the second contact constructions on the inter-level insulation layer. The first contact constructions include first and second plugs stacked in sequence and the second contact constructions include the second plug.

Abstract(Chinese):

半导体器件的互连结构包括设置在半导体衬底上的级间绝缘层。第一接触结构穿透层间绝缘层。第二接触构造穿透层间绝缘层。金属互连将第一接触结构连接到层间绝缘层上的第二接触结构。第一接触构造包括依次堆叠的第一和第二插塞，并且第二接触构造包括第二插塞。

Public/Granted literature

US20050250307A1 Interconnection structures for semicondcutor devices and methods of forming the same Public/Granted day:2005-11-10

Information query

Espacenet

IPC分类:

H	电学
H01	基本电气元件
H01L	半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L21/00	专门适用于制造或处理半导体或固体器件或其部件的方法或设备
H01L21/02	.半导体器件或其部件的制造或处理
H01L21/04	..至少具有一个跃变势垒或表面势垒的器件，例如PN结、耗尽层、载体集结层
H01L21/34	...具有H01L21/06，H01L21/16及H01L21/18各组不包含的或有或无杂质，例如掺杂材料的半导体的器件
H01L21/46	....用H01L21/36至H01L21/428各组不包含的方法或设备处理半导体材料的（在半导体材料上制作电极的入H01L21/44）
H01L21/461	.....改变半导体材料的表面物理特性或形状的，例如腐蚀、抛光、切割
H01L21/4763	......非绝缘层的沉积，例如绝缘层上的导电层、电阻层；这些层的后处理（电极的制造入H01L21/28）