Invention Grant
- Patent Title: Stack package and method for manufacturing the same
- Patent Title (中): 堆栈包装及其制造方法
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Application No.: US12404474Application Date: 2009-03-16
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Publication No.: US07871925B2Publication Date: 2011-01-18
- Inventor: Sung Min Kim , Min Suk Suh
- Applicant: Sung Min Kim , Min Suk Suh
- Applicant Address: KR Kyoungki-do
- Assignee: Hynix Semiconductor Inc.
- Current Assignee: Hynix Semiconductor Inc.
- Current Assignee Address: KR Kyoungki-do
- Agency: Ladas & Parry LLP
- Priority: KR10-2006-0096717 20060930
- Main IPC: H01L21/4763
- IPC: H01L21/4763
Abstract:
A stack package comprises a substrate having a circuit pattern; at least two semiconductor chips stacked on the substrate, having a plurality of through-via interconnection plugs and a plurality of guard rings which surround the respective through-via interconnection plugs, and connected with each other by the medium of the through-via interconnection plugs; a molding material for molding an upper surface of the substrate including the stacked semiconductor chips; and solder balls mounted to a lower surface of the substrate.
Public/Granted literature
- US20090181494A1 STACK PACKAGE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2009-07-16
Information query
IPC分类:
