Invention Grant
- Patent Title: Mixture of oligomeric phenazinium compounds and acid bath for electrolytically depositing a copper deposit
- Patent Title (中): 低聚菲嗪化合物和酸浴的混合物,用于电沉积铜沉积物
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Application No.: US10538286Application Date: 2003-12-09
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Publication No.: US07872130B2Publication Date: 2011-01-18
- Inventor: Heiko Brunner , Wolfgang Dahms , Thomas Moritz , Akif Özkök , Udo Grieser
- Applicant: Heiko Brunner , Wolfgang Dahms , Thomas Moritz , Akif Özkök , Udo Grieser , Olanda Grieser, legal representative , Christopher Grieser, legal representative
- Applicant Address: DE Berlin
- Assignee: Atotech Deutschland GmbH
- Current Assignee: Atotech Deutschland GmbH
- Current Assignee Address: DE Berlin
- Agency: Harding, Earley, Follmer & Frailey, P.C.
- Agent Frank J. Bonini, Jr.; John F. A. Earley, III
- Priority: DE102618526 20021220
- International Application: PCT/EP03/13994 WO 20031209
- International Announcement: WO2004/057061 WO 20040708
- Main IPC: C07D241/46
- IPC: C07D241/46

Abstract:
For the reproducible manufacturing of particularly uniform and brilliant i.e., highly bright copper coatings that are leveled and ductile as well, a copper plating bath is utilized that contains as an additive a mixture of oligomeric phenazinium compounds. The mixture contains at least one phenazinium compound selected from the group comprising compounds containing two monomeric units and compounds containing three monomeric units having the general chemical formulae and set forth in the patent claims and in the specification as well as further oligomeric phenazinium compounds.
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