Invention Grant
US07872200B2 Wired circuit board and connection structure between wired circuit boards
有权
有线电路板和有线电路板之间的连接结构
- Patent Title: Wired circuit board and connection structure between wired circuit boards
- Patent Title (中): 有线电路板和有线电路板之间的连接结构
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Application No.: US11717706Application Date: 2007-03-14
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Publication No.: US07872200B2Publication Date: 2011-01-18
- Inventor: Takahiko Yokai , Toshiki Naito , Yasunari Ooyabu
- Applicant: Takahiko Yokai , Toshiki Naito , Yasunari Ooyabu
- Applicant Address: JP Osaka
- Assignee: Nitto Denko Corporation
- Current Assignee: Nitto Denko Corporation
- Current Assignee Address: JP Osaka
- Agency: Akerman Senterfitt
- Agent Jean C. Edwards, Esq.
- Priority: JP2006-069516 20060314
- Main IPC: H05K1/00
- IPC: H05K1/00
Abstract:
A wired circuit board includes a metal supporting layer, an insulating layer formed on the metal supporting layer and a conductive pattern formed on the insulating layer, and having a terminal portion for connecting to an external terminal. The terminal portion is disposed at an end portion of the conductive pattern, supported on the insulating layer, and exposed from the metal supporting layer to have an end surface thereof used as a point of contact with the external terminal.
Public/Granted literature
- US20070218781A1 Wired circuit board and connection structure between wired circuit boards Public/Granted day:2007-09-20
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