Invention Grant
- Patent Title: Laser bonding tool with improved bonding accuracy
- Patent Title (中): 激光焊接工具具有改善的接合精度
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Application No.: US11096433Application Date: 2005-03-31
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Publication No.: US07872208B2Publication Date: 2011-01-18
- Inventor: David A. Ruben , Christopher T. Kinsey , Jeffrey L. Galvin , Scott B. Sleeper
- Applicant: David A. Ruben , Christopher T. Kinsey , Jeffrey L. Galvin , Scott B. Sleeper
- Applicant Address: US MN Minneapolis
- Assignee: Medtronic, Inc.
- Current Assignee: Medtronic, Inc.
- Current Assignee Address: US MN Minneapolis
- Agent Carol F. Barry
- Main IPC: B23K26/00
- IPC: B23K26/00
Abstract:
A bonding tool for use in a laser bonding apparatus comprises an elongated body portion and a foot portion coupled thereto. The foot portion extends substantially transversely from the body portion and has a laser aperture and a guide channel therethrough. The guide channel is disposed between the body portion and the laser aperture.
Public/Granted literature
- US20060219672A1 Laser bonding tool with improved bonding accuracy Public/Granted day:2006-10-05
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