Invention Grant
- Patent Title: Method for the connection of two wafers, and a wafer arrangement
- Patent Title (中): 用于连接两个晶片的方法和晶片装置
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Application No.: US11068291Application Date: 2005-02-28
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Publication No.: US07872210B2Publication Date: 2011-01-18
- Inventor: Klaus Streubel
- Applicant: Klaus Streubel
- Applicant Address: DE Regensburg
- Assignee: Osram Opto Semiconductors GmbH
- Current Assignee: Osram Opto Semiconductors GmbH
- Current Assignee Address: DE Regensburg
- Agency: Cohen Pontani Lieberman & Pavane LLP
- Priority: DE102004009625 20040227; DE102004012013 20040311
- Main IPC: B23K26/00
- IPC: B23K26/00
Abstract:
A method for the connection of two wafers (11, 12), in which a contact area (15) is formed between the wafers (11, 12) by placing the two wafers one on top of the other, and in which the contact area (15) is heated locally and for a limited time. A wafer arrangement is also described in which two wafers (11, 12) which have been placed one on top of the other and between whose opposite surfaces a contact area (15) is located. The wafers are connected to one another at selected areas (21) of their contact area.
Public/Granted literature
- US20050211678A1 Method for the connection of two wafers, and a wafer arrangement Public/Granted day:2005-09-29
Information query
