Invention Grant
US07872212B2 Use of mesa structures for supporting heaters on an integrated circuit
有权
在集成电路上使用台面结构来支撑加热器
- Patent Title: Use of mesa structures for supporting heaters on an integrated circuit
- Patent Title (中): 在集成电路上使用台面结构来支撑加热器
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Application No.: US12270310Application Date: 2008-11-13
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Publication No.: US07872212B2Publication Date: 2011-01-18
- Inventor: Tyler Sims
- Applicant: Tyler Sims
- Applicant Address: SG Singapore
- Assignee: Avago Technologies Fiber IP (Singapore) Pte. Ltd.
- Current Assignee: Avago Technologies Fiber IP (Singapore) Pte. Ltd.
- Current Assignee Address: SG Singapore
- Main IPC: H05B1/00
- IPC: H05B1/00 ; G02B6/42
Abstract:
An integrated circuit is joined to a liquid container. The integrated circuit includes a passivation layer. A resistor is used as a heater to heat fluid in a liquid container. A mesa structure is formed over the passivation layer. The mesa structure is in contact with the resistor and is used to more effectively deliver heat from the resistor to the liquid container.
Public/Granted literature
- US20090070987A1 Use of Mesa Structures for Supporting Heaters on an Integrated Circuit Public/Granted day:2009-03-19
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