Invention Grant
- Patent Title: Vertical gallium nitride semiconductor device and epitaxial substrate
- Patent Title (中): 垂直氮化镓半导体器件和外延衬底
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Application No.: US11569798Application Date: 2006-03-01
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Publication No.: US07872285B2Publication Date: 2011-01-18
- Inventor: Shin Hashimoto , Makoto Kiyama , Tatsuya Tanabe , Kouhei Miura , Takashi Sakurada
- Applicant: Shin Hashimoto , Makoto Kiyama , Tatsuya Tanabe , Kouhei Miura , Takashi Sakurada
- Applicant Address: JP Osaka
- Assignee: Sumitomo Electric Industries, Ltd.
- Current Assignee: Sumitomo Electric Industries, Ltd.
- Current Assignee Address: JP Osaka
- Agent James W. Judge
- Priority: JP2005-061174 20050304
- International Application: PCT/JP2006/303828 WO 20060301
- International Announcement: WO2006/093174 WO 20060908
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/207 ; H01L29/20

Abstract:
Affords epitaxial substrates for vertical gallium nitride semiconductor devices that have a structure in which a gallium nitride film of n-type having a desired low carrier concentration can be provided on a gallium nitride substrate of n type. A gallium nitride epitaxial film (65) is provided on a gallium nitride substrate (63). A layer region (67) is provided in the gallium nitride substrate (63) and the gallium nitride epitaxial film (65). An interface between the gallium nitride substrate (43) and the gallium nitride epitaxial film (65) is positioned in the layer region (67). In the layer region (67), a peak value of donor impurity along an axis from the gallium nitride substrate (63) to the gallium nitride epitaxial film (65) is 1×1018 cm−3 or more. The donor impurity is at least either silicon or germanium.
Public/Granted literature
- US20090194796A1 Vertical Gallium Nitride Semiconductor Device and Epitaxial Substrate Public/Granted day:2009-08-06
Information query
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