Invention Grant
US07872313B2 Semiconductor device having an expanded storage node contact and method for fabricating the same 失效
具有扩展存储节点接触的半导体器件及其制造方法

  • Patent Title: Semiconductor device having an expanded storage node contact and method for fabricating the same
  • Patent Title (中): 具有扩展存储节点接触的半导体器件及其制造方法
  • Application No.: US12345923
    Application Date: 2008-12-30
  • Publication No.: US07872313B2
    Publication Date: 2011-01-18
  • Inventor: Tae O Jung
  • Applicant: Tae O Jung
  • Applicant Address: KR Gyeonggi-do
  • Assignee: Hynix Semiconductor Inc.
  • Current Assignee: Hynix Semiconductor Inc.
  • Current Assignee Address: KR Gyeonggi-do
  • Agency: Ladas & Parry LLP
  • Priority: KR10-2008-0110123 20081106
  • Main IPC: H01L21/70
  • IPC: H01L21/70
Semiconductor device having an expanded storage node contact and method for fabricating the same
Abstract:
A semiconductor device is disclosed that stably ensures an area of a storage node contact connected to a junction region in an active region of the semiconductor device and is thus able to improve the electrical properties of the semiconductor device and enhance a yield, and a method for fabricating the same. The semiconductor device includes a semiconductor substrate having an active region including a gate, a storage node contact region, and an isolation region that defines the active region. A passing gate and an isolation structure surrounding the passing gate are formed in the isolation region. A silicon epitaxial layer is selectively formed over an upper portion of the passing gate to expand the storage node contact region.
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