Invention Grant
- Patent Title: Semiconductor device and method of manufacturing semiconductor device
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US12119864Application Date: 2008-05-13
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Publication No.: US07872316B2Publication Date: 2011-01-18
- Inventor: Toshihiko Iwata
- Applicant: Toshihiko Iwata
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: SNR Denton US LLP
- Priority: JP2007-131452 20070517
- Main IPC: H01L29/49
- IPC: H01L29/49 ; H01L29/51

Abstract:
Disclosed herein is a semiconductor device including a gate insulating film formed over a semiconductor substrate, and a gate electrode formed over the gate insulating film, wherein the gate insulating film is so provided as to protrude from both sides of the gate electrode, and the gate electrode includes a wholly silicided layer.
Public/Granted literature
- US20080283974A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE Public/Granted day:2008-11-20
Information query
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