Invention Grant
- Patent Title: Microelectromechanical device packages with integral heaters
- Patent Title (中): 具有整体式加热器的微机电设备封装
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Application No.: US12266789Application Date: 2008-11-07
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Publication No.: US07872338B2Publication Date: 2011-01-18
- Inventor: Terry Tarn
- Applicant: Terry Tarn
- Applicant Address: US TX Dallas
- Assignee: Texas Instruments Incorporated
- Current Assignee: Texas Instruments Incorporated
- Current Assignee Address: US TX Dallas
- Agent Charles A. Brill; Wade James Brady, III; Frederick J. Telecky, Jr.
- Main IPC: H01L23/02
- IPC: H01L23/02
Abstract:
A microelectromechanical device package with integral a heater and a method for packaging the microelectromechanical device are disclosed in this invention. The microelectromechanical device package comprises a first package substrate and second substrate, between which a microelectromechanical device, such as a micromirror array device is located. In order to bonding the first and second package substrates so as to package the microelectromechanical device inside, a sealing medium layer is deposited, and heated by the heater so as to bond the first and second package substrates together.
Public/Granted literature
- US20090072380A1 Microelectromechanical Device Packages with Integral Heaters Public/Granted day:2009-03-19
Information query
IPC分类:
