Invention Grant
- Patent Title: Multi-chip module
- Patent Title (中): 多芯片模块
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Application No.: US11733679Application Date: 2007-04-10
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Publication No.: US07872350B2Publication Date: 2011-01-18
- Inventor: Ralf Otremba , Josef Hoeglauer , Stefan Landau , Erwin Huber
- Applicant: Ralf Otremba , Josef Hoeglauer , Stefan Landau , Erwin Huber
- Applicant Address: DE Munich
- Assignee: Qimonda AG
- Current Assignee: Qimonda AG
- Current Assignee Address: DE Munich
- Agent John S. Economou
- Main IPC: H01L23/02
- IPC: H01L23/02

Abstract:
A multi-chip module includes at least one integrated circuit chip that is electrically connected to first external terminals of the multi-chip module and at least one power semiconductor chip that is electrically connected to second external terminals of the multi-chip module. All first external terminals of the multi-chip module are arranged in a contiguous region of an terminal area of the multi-chip module.
Public/Granted literature
- US20080251912A1 Multi-Chip Module Public/Granted day:2008-10-16
Information query
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