Invention Grant
- Patent Title: Glass-sealed light emitting element, circuit board with the glass-sealed light emitting element, and methods for manufacturing those
- Patent Title (中): 玻璃密封发光元件，具有玻璃密封发光元件的电路板及其制造方法
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Application No.: US11870714Application Date: 2007-10-11
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Publication No.: US07872417B2Publication Date: 2011-01-18
- Inventor: Nobuhiro Nakamura , Syuji Matsumoto , Hitoshi Onoda , Yutaka Segawa , Tetsuro Matsumoto , Hiroshi Usui
- Applicant: Nobuhiro Nakamura , Syuji Matsumoto , Hitoshi Onoda , Yutaka Segawa , Tetsuro Matsumoto , Hiroshi Usui
- Applicant Address: JP Tokyo
- Assignee: Asahi Glass Company, Limited
- Current Assignee: Asahi Glass Company, Limited
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2005-118415 20050415; JP2005-322943 20051107
- Main IPC: H01J1/62
- IPC: H01J1/62 ; H01L33/00
Abstract:
A diode chip is sealed by a glass material.There are provided a light emitting diode chip and a glass member in close contact with at least one portion of the surface of the light emitting diode chip. The glass member has a surface shape containing a curved surface at least a portion thereof. The curved surface is preferably a portion of a spherical surface or a spheroidal surface. The glass member has a surface shape containing a spherical portion and a flat portion, and the diode chip is preferably disposed on the flat portion.
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