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Invention Grant
US07872459B2 Semiconductor integrated circuit device and regulator using it 有权
半导体集成电路器件和调节器使用它

Semiconductor integrated circuit device and regulator using it
Abstract:
A semiconductor integrated circuit device (IC1) comprises a semiconductor chip (CHIP1), a first frame lead (FR1), and a second frame lead (FR2). The semiconductor chip (CHIP1) includes common-base transistors (P1, P2), pads (T11, T12) connected to the respective emitters of the common-base transistors (P1, P2), pads (T21, T22) connected to the respective collectors of the common-base transistors (P1, P2), and a means (DRV, ERR, E1) for generating a base signal. The pads (T11, T12) are connected through the respective bonding wires (W11, W12) to the first frame lead (FR1). The pads (T21, T22) are connected through the respective bonding wires (W21, W22) to the second frame lead (FR2). This structure can easily detect breaking of the bonding wires connected in parallel.
Abstract(Chinese):

半导体集成电路器件（IC1）包括半导体芯片（CHIP1），第一框架引线（FR1）和第二框架引线（FR2）。 半导体芯片（CHIP1）包括公共基极晶体管（P1，P2），连接到公共基极晶体管（P1，P2）的各个发射极的焊盘（T11，T12），连接到相应的晶体管 共同基极晶体管（P1，P2）的集电极和用于产生基本信号的装置（DRV，ERR，E1）。 焊盘（T11，T12）通过各个接合线（W11，W12）连接到第一框架引线（FR1）。 焊盘（T21，T22）通过各个接合线（W21，W22）连接到第二框架引线（FR2）。 这种结构可以容易地检测并联连接的接合线的断裂。

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