Invention Grant
- Patent Title: Chip pin test apparatus
- Patent Title (中): 芯片测试装置
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Application No.: US12475510Application Date: 2009-05-30
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Publication No.: US07872484B2Publication Date: 2011-01-18
- Inventor: Zheng-Heng Sun
- Applicant: Zheng-Heng Sun
- Applicant Address: TW Tu-Cheng, Taipei Hsien
- Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: TW Tu-Cheng, Taipei Hsien
- Agent Zhigang Ma
- Priority: CN200910301996 20090430
- Main IPC: G01R31/28
- IPC: G01R31/28

Abstract:
A test apparatus includes a printed circuit board, a chip carrier socket, and a display circuit. The chip carrier socket includes a space to receive a chip including a plurality of pins, a plurality of contact terminals, and a grounded ground portion. The display circuit includes a power supply and a plurality of light-emitting elements. When the chip is received in the space, the ground portion contacts a middle portion of each pin. When a pin of the chip is normal, a distal end of the normal pin contacts a corresponding contact terminal to connect a corresponding light-emitting element to the ground portion, causing the light-emitting element to light up. When a pin of the chip is askew, a distal end of the askew pin cannot contact a corresponding contact terminal, the corresponding light-emitting element will not light up.
Public/Granted literature
- US20100277194A1 CHIP PIN TEST APPARATUS Public/Granted day:2010-11-04
Information query