Invention Grant
US07872874B2 Printed-wiring board with built-in component, manufacturing method of printed-wiring board with built-in component, and electronic device
失效
具有内置元件的印刷电路板，具有内置元件的印刷电路板的制造方法和电子设备
- Patent Title: Printed-wiring board with built-in component, manufacturing method of printed-wiring board with built-in component, and electronic device
- Patent Title (中): 具有内置元件的印刷电路板，具有内置元件的印刷电路板的制造方法和电子设备
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Application No.: US11701816Application Date: 2007-02-01
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Publication No.: US07872874B2Publication Date: 2011-01-18
- Inventor: Jun Karasawa , Daigo Suzuki , Hidenori Tanaka
- Applicant: Jun Karasawa , Daigo Suzuki , Hidenori Tanaka
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Blakely, Sokoloff, Taylor & Zafman LLP
- Priority: JP2006-084091 20060324
- Main IPC: H05K7/10
- IPC: H05K7/10 ; H05K7/12
Abstract:
According to one embodiment, there is provided a printed-wiring board with a component in which an electronic component is mounted on a pattern-forming surface of a base material. In the printed-wiring board, a guiding path for guiding, to the outside, a void formed in mounting the electronic component is formed on the pattern-forming surface.
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