Invention Grant
US07873585B2 Apparatus and methods for predicting a semiconductor parameter across an area of a wafer 有权
用于预测跨晶片区域的半导体参数的装置和方法

Apparatus and methods for predicting a semiconductor parameter across an area of a wafer
Abstract:
Apparatus and methods are provided for predicting a plurality of unknown parameter values (e.g. overlay error or critical dimension) using a plurality of known parameter values. In one embodiment, the method involves training a neural network to predict the plurality of parameter values. In other embodiments, the prediction process does not depend on an optical property of a photolithography tool. Such predictions may be used to determine wafer lot disposition.
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