Invention Grant
US07875801B2 Thermoplastic-based, carbon nanotube-enhanced, high-conductivity wire
有权
基于热塑性，碳纳米管增强的高导电丝
- Patent Title: Thermoplastic-based, carbon nanotube-enhanced, high-conductivity wire
- Patent Title (中): 基于热塑性，碳纳米管增强的高导电丝
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Application No.: US12348595Application Date: 2009-01-05
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Publication No.: US07875801B2Publication Date: 2011-01-25
- Inventor: Thomas K. Tsotsis
- Applicant: Thomas K. Tsotsis
- Applicant Address: US IL Chicago
- Assignee: The Boeing Company
- Current Assignee: The Boeing Company
- Current Assignee Address: US IL Chicago
- Agency: Armstrong Teasdale LLP
- Main IPC: H01B5/00
- IPC: H01B5/00
Abstract:
A conductive wire includes a plurality of thermoplastic filaments each having a surface, and a coating material having a plurality of carbon nanotubes dispersed therein. The coating material is bonded to the surface of each thermoplastic filament. The thermoplastic filaments having the coating bonded thereto are bundled and bonded to each other to form a substantially cylindrical conductor.
Public/Granted literature
- US20100170694A1 THERMOPLASTIC-BASED, CARBON NANOTUBE-ENHANCED, HIGH-CONDUCTIVITY WIRE Public/Granted day:2010-07-08
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